DOD Awards $49 Million to Improve Advanced Semiconductor Packaging Capabilities

The Department of Defense announced the award of two contracts totaling $49 million to revitalize advanced packaging capabilities and capacity for semiconductors used in defense applications. The awards were made through the Industrial Base Analysis and Sustainment (IBAS) program to Micross Components and the government of Osceola County, Florida. These awards, which focus on low-volume/high-mix production of secure 2.5 and/or 3D advanced packaging solutions, include options for further expanding the advanced packaging ecosystem and associated technologies. They are part of DOD's Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) efforts, and directly support the National Defense Industrial Strategy 's strategic priority of building resilient supply chains.