Department of Defense to Expand Manufacturing of Printed Circuit Board Assemblies for Hypersonic Weapons

Department of Defense to Expand Manufacturing of Printed Circuit Board Assemblies for Hypersonic Weapons

Country

United States

State / City

Simsbury, CT

Posted date

2024-03-08
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The Department of Defense has announced an award of $11.7 million via the Defense Production Act Investment (DPAI) Program to Ensign-Bickford Aerospace & Defense (EBAD). The aim of this award is to provide additional printed circuit board assembly (PCBA) production capacity at their Simsbury, CT location. EBAD is expected to increase existing capacity and manufacturing processes to reduce cost and accelerate PCBA production. This effort is considered a key component of the DoD’s strategy to accelerate the development and fielding of hypersonic systems and deliver cutting-edge capabilities to the armed forces.

Instrument

Allocation of Funds

Purpose

Investment promotion
Production incentives
Self-reliance
National security

Agency

U.S. Department of Defense

Sector

Aerospace & Defense

Data+Law uuid

USA_03727_Program

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